DOPO (9,10-Dihydro-9-oxa-10-phosphaphenanthrene 10-Oxide)

General Properties:

• Molecular Formula: C₁₂H₉O₂P

• Appearance: White to off-white crystalline solid

• Melting Point: ~115–120 °C

• Solubility: Slightly soluble in water; soluble in organic solvents

Applications:

• Epoxy Resin Flame Retardant

  • Used as a reactive or additive flame retardant in epoxy systems for electronics, laminates, and structural composites.

• Plastics & Polymers

  • Incorporated into polyamides, polyesters, and other high-performance polymers to improve fire resistance.

• Electronics & Electrical Materials

  • Helps meet UL-94 and other fire safety requirements for circuit boards, connectors, and housings.

• Reactive Flame-Retardant Intermediates

  • Serves as a building block for DOPO derivatives used in advanced polymer systems.

• Coatings & Adhesives

  • Improves flame resistance in protective coatings and specialty adhesive formulations.

Advantages:

• Halogen-Free Flame Retardancy: Supports environmentally preferred flame-retardant systems without halogenated additives.

• Excellent Thermal Stability: Performs well in high-temperature polymer processing environments.

• Reactive Functionality: Can chemically bond into polymer matrices, reducing migration and improving durability.

• Maintains Mechanical Properties: Provides fire protection without significantly compromising strength or electrical performance.

• Versatile Polymer Compatibility: Suitable for epoxies, polyamides, polyesters, and specialty resins.

Safety & Handling:

DOPO should be handled using standard industrial chemical safety practices.

• Dust may cause mild eye, skin, or respiratory irritation

• Avoid inhalation of airborne particles